Molex 70066 70058 wire harness cables
Applications:
- Cable Length & Termination customized
- Pitch: 2.54mm
- pins: 2 to 15 positions
- Material: Liquid Crystal Polymer (LCP)
- Contact: Brass Plating
- Contact Area: Matte tin or select gold
- Solder Tail Area: Matte tin/Underplating: Nickel
- Current rating: 3A (AWG #22 to #30)
- Voltage rating: 250V AC, DC
Product Detail
Product Tags
Technical Specifications |
Specifications |
Series: STC-002544001 Series
Contact Pitch: 2.54mm No. of Contacts: 2 to 15 positions Current: 3A (AWG #22 to #30) Compatible: Cross Molex 70066/70107 Connector Series |
Select Components |
Cable Assemblies Refer |
General Specification |
Current Rating: 3A
Voltage Rating: 250V Temperature Range: -20°C~+105°C Contact Resistance: 20m Omega Max Insulation Resistance: 1000M Omega Min Withstanding Voltage: 1000V AC/minute |
Overview |
Pitch 2.54mm Molex 70066/70107 type wire to board connector wire harnessWith its large number of options and configurations, SL Modular Connectors and Assemblies deliver ideal wire-to-wire solutions and its varying PCB termination methods, including reflow process capable versions, support a range of wire-to-board applications
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Features |
Terminal position assurance (TPA) lock Reduces the risk of terminal back-out in high-vibration environments Tape-and-reel packaging available with optional pick-and-place vacuum caps allows for the use of more highly automated termination processes. Protects SMT headers during shipping/handling Enables the use of an automated vacuum-pick and --place machine for high-speed processing and accurate placement on PCBLow-profile, stackable housing, vertical and right-angle headersProvides design flexibility with or without panel mounting Discrete-wire-crimp, FFC and IDT termination styles available Offers several wire-connection options for design flexibility2.54mm pitch connector Position Assurance (CPA) lock ensures wire-to-wire and wire-to-board mating interface will not disengage in high-vibration environmentsPositive-lock mating interface ensures secure retention with receptacles in high-vibration environmentsTerminal features two independent points of contact Offers redundant, secondary current paths for long-term electrical performance and reliability Split-peg PCB header options Maintains header position on PCB during solder process High-temperature headers available, made with liquid crystal polymer (LCP) Reflow process capable
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Advantages |
As consumer electronics become more prevalent, contract manufacturers (CMs) are continually being driven to produce more devices at lower costs. The comprehensive SL Modular Connector System now includes high-temperature LCP headers that are reflow process capable to enable the automation of termination on PCBs and reduce labor costs
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Application |
Airbag sensors
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