1.25mm HRS DF13 type wire to board connector wire harness

Contact Pitch:                                                               1.25mm

No. of Contacts:                                                            2-15 or 2*5,2*10,2*15,2*20 positions

Current:                                                                        1A (AWG #28 to #32) (Max. OD: 1.0mm)

Compatible:                                                                  Cross Hirose DF13 Connector Series

Voltage Rating:                                                              125V

Temperature Range:                                                      -20°C~+85°C

Contact Resistance:                                                      20m Omega Max

Insulation Resistance:                                                   1000M Omega Min

Withstanding Voltage:                                                    500V AC/minute

Pitch 1.25mm Double row 1.25mm HRS DF13 type wire to board connector

1. Peak temperature: 250℃ max.

2. Heating area: 230℃ min. for less than 60 seconds

3. Preheating area: 170℃ to 190℃ for 60 to 120 seconds

4. Number of times: no more than 2 times * Measurement is conducted at the contact lead part Soldering results may change depending on conditions such as solder paste type, manufacturer, PCB size, and other soldering materials. Please determine all mounting conditions before

1. Miniature Size Designed in the low profile at a mounting height of 5.8mm. (SMT mounting straight type) (For the DIP type, the mounting height is 5.3mm to the straight and 3.6mm at the right angle)

2. Multi-contact The double row type achieves the multi-contact up to 40 contacts, and secures 30% higher density in the mounting area, compared with the single row type.

3. Correspond to Automatic Mounting The header provides the grade with the vacuum absorption area, and secures automatic mounting by the embossed tape packaging. In addition, the tube packaging can be selected. 

4. Integral Basic Function Despite Miniature Size The header is designed in a scoop-proof box structure, and completely prevents mis-insertion. In addition, the surface mounting (SMT) header is equipped with a metal fitting to prevent solder peeling. 

Note 1: This temperature profile is a recommended value.

Note 2: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return to normal temperature between the first and second cycle.

Note 3: The temperature profile indicates the board surface temperature at the point of contact with the connector terminals.

Note 4: Slight variations in the color of the plastic compounds do not affect the form, fit, or function of the connector

Note:

PC, mobile terminal, miniature type business equipment, and other various consumer equipment, including video camera